Boss Audio Systems C-650 Wartungshandbuch

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SERVICE MANUAL
PORTABLE MINIDISC RECORDER
MZ-NH900
Ver 1.1 2004.09
SPECIFICATIONS
9-879-121-02
2004I05-1
© 2004.09
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
US and foreign patents licensed from Dolby
Laboratories.
Model Name Using Similar Mechanism NEW
MD Mechanism Type MT-MZNH900-181
Optical Pick-up Name ABX-U
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Chinese Model
Tourist Model
SonicStage and SonicStage logo are trademarks or registered trademarks of Sony Corporation.
MD Simple Burner, OpenMG, Magic Gate, MagicGate Memory Stick, Memory Stick,
Hi-MD, Net MD, ATRAC, ATRAC3, ATRAC3plus and their logos are trademarks of
Sony Corporation.
Microsoft, Windows, Windows NT and Windows Media are trademarks or registered
trademarks of Microsoft Corporation in the United States and /or other countries.
IBM and PC/AT are registered trademarks of International Business Machines Corporation.
Macintosh is a trademark of Apple Computer, Inc. in the United States and/or other countries.
MMX and Pentium are trademarks or registered trademarks of Intel Corporation.
All other trademarks and registered trademarks are trademarks or registered trademarks of their
respective holders.
Inputs
1)
MIC: stereo mini-jack
(minimum input level 0.13 mV)
Line in:
stereo mini-jack for analog input
(minimum input level 49 mV)
optical (digital) mini-jack for optical
(digital) input
Outputs
i/LINE OUT
2)
: stereo mini-jack (dedicated
remote control jack)/194 mV (10 k)
Maximum output (DC)
2)
Headphones:
3 mW + 3 mW (16 ) (European models)
5 mW + 5 mW (16 ) (Other models)
Power requirements
Sony AC Power Adaptor connected at the DC
IN 3V jack:
120 V AC, 60 Hz (Models for USA, Canada,
Mexico and Taiwan)
240 V AC, 50 Hz (Model for Australia)
220 V AC, 50 Hz (Models for China and
Argentine)
100 - 240 V AC, 50/60 Hz (Other models)
The recorder:
Nickel metal hydride rechargeable battery
NH-10WM 1.2V 900 mAh (MIN) Ni-MH
LR6 (size AA) alkaline battery
Battery charging stand:
AC power adaptor DC 3V
Operating temperature
+5° C (+41°F) to +35° C (+95°F)
Dimensions
Approx. 81.3 × 77.8 × 21.2 mm (w/h/d)
(3
1
/
4
× 3
1
/
8
×
27
/
32
in.) (excluding projecting
parts and controls)
Mass
Approx. 110 g (3.9 oz) (the recorder only)
Approx. 133 g (4.7 oz) (including the
Supplied accessories
AC power adaptor (1)
Battery charging stand (1)
Remote control (1)
Headphones (for USA model) (1)
Earphones (except USA model) (1)
Dedicated USB cable (1)
NH-10WM Nickel metal hydride rechargeable
battery (1)
Dry battery case (1)
Battery carrying case (1)
Clamp filter (2)
CD-ROM (SonicStage/MD Simple Burner) (1)*
Optical cable (1)
Carrying pouch (except USA model) (1)
*Do not play a CD-ROM on an audio CD
player.
rechargeable battery)
1)
The LINE IN (OPT) jack is used to connect
either a digital (optical) cable or a line
(analog) cable.
2)
The i/LINE OUT jack connects either
headphones/earphones or a line cable.
3)
Measured in accordance with JEITA.
Design and specifications are subject to change
without notice.
Audio playing system
MiniDisc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ = 790 nm
Emission duration: continuous
Laser output: less than 44.6 µW
(This output is the value measured at a distance
of 200 mm from the lens surface on the optical
pick-up block with 7 mm aperture.)
Recording and playback time
When using HMD1G (1GB disc):
Maximum 34 hours in Hi-LP stereo
When using MDW-80 in Hi-MD mode:
Maximum 10 hours and 10 min. in Hi-LP
stereo
When using MDW-80 in MD mode:
Maximum 160 min. in monaural
Maximum 320 min. in LP4 stereo
Revolutions
350 rpm to 3,000 rpm (CLV)
Error correction
Hi-MD:
LDC (Long Distance Code)/BIS (Burst
Indicator Subcode)
MD:
ACIRC (Advanced Cross Interleave Reed
Solomon Code)
Sampling frequency
44.1 kHz
Sampling rate converter
Input: 32 kHz/44.1 kHz/48 kHz
Coding
Hi-MD:
AT RAC 3plus (Adaptive TRansform
Acoustic Coding 3 plus)
MD:
AT RAC
AT RAC3 — LP2/LP4
Modulation system
Hi-MD:
1-7RLL (Run Length Limited)/PRML
(Partial Response Maximum Likelihood)
MD:
EFM (Eight to Fourteen Modulation)
Frequency response
20 to 20,000 Hz ± 3 dB
For other Service and User Manuals, go to www.ManualDepot.com
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Inhaltsverzeichnis

Seite 1 - MZ-NH900

SERVICE MANUALPORTABLE MINIDISC RECORDERMZ-NH900Ver 1.1 2004.09SPECIFICATIONS9-879-121-022004I05-1© 2004.09Sony CorporationPersonal Audio CompanyPubl

Seite 2

10MZ-NH9003-7. GEAR (BSA), GEAR (SB)1self tap screw2thrust retainer spring3washer (0.8-2.5)4gear (BSA)5gear (SB)3-6. BATTERY CASE BLOCK4screw(M1.4)

Seite 3

11MZ-NH9003-8. OP SERVICE ASSY3-9. DC MOTOR SSM18D/C-NP (SPINDLE) (M701), DC MOTOR (SLED) (M702),DC MOTOR UNIT (OVER WRITE HEAD UP/DOWN) (M

Seite 4 - SECTION 1

12MZ-NH9003-10. HOLDER ASSY4Remove the holder assy to the direction of the arrow A.3Open the holder assy.1boss2bossA3-11. POSITION OF FERRITE CORE

Seite 5 - SECTION 2

13MZ-NH900SECTION 4TEST MODEOUTLINEA key having no particular description in the text, indicates a setkey.1. ENTERING THE TEST MODEPreparation:Co

Seite 6

14MZ-NH9005. MANUAL MODEThis is mode to adjust or check the operation of the set by function.Operation of The Manual Mode1. Enter the test mode (Disp

Seite 7 - DISASSEMBLY

15MZ-NH9006. OVERALL ADJUSTMENT MODE6-1. Operation of The Overall Adjustment Mode1. Enter the test mode (Display Check mode).2. Press the [VOL--] ke

Seite 8

16MZ-NH90011*$$$$$$ ##888SET OK ##888RMC OK ##Flow of Self-diagnosis Result Display mode operation:7-2. Error Code of The Self-Diagnosis Result Displa

Seite 9

17MZ-NH900SECTION 5ELECTRICAL ADJUSTMENTS1. PRECAUTIONS FOR ADJUSTMENT1. Adjustment must be done in the test mode only. After adjusting,release the

Seite 10

18MZ-NH9003-4-2. PwrAdj adjustmentsRepeat the following procedures and adjust all contents of “table 3-4-1. PwrAdj Specifications”.Example Display (It

Seite 11 - OP service assy

19MZ-NH9003-4-3. VBsAdj adjustmentsProcedure:1. In the “3-4-2. PwrAdj Adjustments” completed status, pressthe > key to display as follows.Display

Seite 12

MZ-NH9002Notes on chip component replacement• Never reuse a disconnected chip component.• Notice that the minus side of a tantalum capacitor may bedam

Seite 13 - TEST MODE

20MZ-NH900Example of Calculation:Item No. ParameterResultDecimal Hexadecimal0211 Pr_nominal 2.50 mW 50 32h0212 Kr −0.3 %/°C30 1Eh0213 Pw_nominal 7.35

Seite 14

21MZ-NH9003-8. Servo Overall AdjustmentNote1: Be sure to adjustment so that the set is horizontal and the LCD isupside. Unless performed in that state

Seite 15

22MZ-NH900MEMO

Seite 16

MZ-NH9002323MZ-NH9008484740414223935213233756154555051524915141819IYVREFOPTICALPICK-UPBLOCK(ABX-U)HR601OVERWRITEHEADDD_CPD_IPDO_SOURCECBAVREF10A_CJYJX

Seite 17 - ELECTRICAL ADJUSTMENTS

MZ-NH9002424MZ-NH900+1.2VREGULATORIC302SYSTEM CONTROLLER,DIGITAL SIGNAL PROCESSORIC801 (2/3)314UDP318UPUEN315UDM32DATA+DATA–1VBUSCN451(USB)320UOSCO319

Seite 18

MZ-NH9002525MZ-NH900246SYSTEM CONTROLLERIC801 (3/3)GND_SW226 219 73 256 257 207VREC_SELVBUS_VB_CTL25LGVCO1117LVB27VB14L113L138L237L2DW_2BDW_2T55REGI15

Seite 19

MZ-NH9002626MZ-NH900• Note For Printed Wiring Boards and Schematic Diagrams• MAIN board is multi-layer printed board.However, the patterns of intermed

Seite 20

MZ-NH9002727MZ-NH900R712C713C715C717C716C714R706R707R708C701C702C703R709R710R711C705C706C707C708C710C709L701 L702IC701BP701C712R713CN70100.10.10.10.10

Seite 21

MZ-NH9002828MZ-NH9006-5. SCHEMATIC DIAGRAM – MAIN Section (2/9) –• See page 38 for IC Block Diagrams.Q611Q615W601W602IC606C668C669R663R662R660 R661C

Seite 22

MZ-NH9002929MZ-NH900The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.Les

Seite 23 - DIAGRAMS

MZ-NH9003TABLE OF CONTENTS1. SERVICING NOTES ... 42. GENERAL ...

Seite 24

MZ-NH9003030MZ-NH900Q451Q403FB451FB452R455R456R421C425 C427Q452R462 D458R467C453C402 C403LF451D440CN451C429C459C458C456D457R466R464R463R425R436LF401C4

Seite 25

MZ-NH9003131MZ-NH9006-8. SCHEMATIC DIAGRAM – MAIN Section (5/9) –• See page 38 for IC Block Diagrams.C959C901R924C958IC901C924D905C920C916C908R904C9

Seite 26

MZ-NH9003232MZ-NH900FB353FB357IC351D152D252C370C352C151C251R352R251 R151R355R360R254R154C351R351Q352C154Q251R361C361C364R354R358C365C360C362C354C368C3

Seite 27

MZ-NH9003333MZ-NH9006-10. SCHEMATIC DIAGRAM – MAIN Section (7/9) –• See page 38 for IC Block Diagrams.R476 R477R471R472R473R475R490R491R894C481C479

Seite 28

MZ-NH9003434MZ-NH9006-11. SCHEMATIC DIAGRAM – MAIN Section (8/9) –• See page 26 for Waveforms. • See page 42 for IC Pin Function Description.R825C80

Seite 29

MZ-NH9003535MZ-NH9006-12. SCHEMATIC DIAGRAM – MAIN Section (9/9) –• See page 26 for Waveforms. • See page 38 for IC Block Diagrams.C325R309R310R312C

Seite 30

MZ-NH9003636MZ-NH9006-13. PRINTED WIRING BOARD – MAIN Section (1/2) – : Uses unleaded solder.Q301D303D302Q451BCES890S891CN451(USB)CN451(FRONT VIEW)

Seite 31

MZ-NH9003737MZ-NH9006-14. PRINTED WIRING BOARD – MAIN Section (2/2) – : Uses unleaded solder.C545C536C526C538C531C529C525C559R512C528C523C550C513C5

Seite 32

MZ-NH9003838MZ-NH900• IC Block DiagramsIC301 AK5356VN-LIC351 CXD9811KLIN28A/DCONVERTERAUDIOINTERFACECONTROLLERCDTI11SDTOMICLPREOLPRENLPRELPRERPRENRPRE

Seite 33

39MZ-NH90085NC A1286HOLD OUT87RST OUT88PVBUS1NC_A12DW 1B3DW 1T4VRECO 25VRECO 1L1 16L1 27INP18UP 1T9UP 1B10GND11PGND113VC14VC15PGND316PGND117UP 3B18VRE

Seite 34

4MZ-NH900SECTION 1SERVICING NOTESThe laser diode in the optical pick-up block may suffer electrostaticbreak-down because of the potential difference

Seite 35

40MZ-NH90012VDDGNDCEREGULATORCURRENTLIMIT3VOUT5ECO4IC602 R1160N121B-TR-FA12354+–BUFFERVLX LIMITERCHIPENABLEREFERENCEVOLTAGEPFM CONTROLOSC 100kHzVDDCEV

Seite 36

41MZ-NH900IC891 AK6514CF-E218765234Y DECODER X DECODERADDRESS GENERATORHIGH VOLTAGEGENERATORMEMORYARRAYY SELECT &SENSE AMPCONTROLLOGICSERIAL-PARAL

Seite 37

42MZ-NH900IC801 CXD2681-223GG (SYSTEM CONTROLLER, DIGITAL SIGNAL PROCESSOR)Pin No. Pin Name I/O Description1 DVDD1_0 — Power supply terminal2 DVSS1_0

Seite 38

43MZ-NH900Pin No. Pin Name I/O Description47 DAVDD — Power supply terminal (for D/A converter)48 DVDD25LPF — Power supply terminal (for D/A converter)

Seite 39

44MZ-NH900Pin No. Pin Name I/O Description102 PCO O Phase comparison output terminal for the playback EFM system master PLL103 FILI I Filter input ter

Seite 40

45MZ-NH900Pin No. Pin Name I/O Description146 VREFL IReference voltage terminal connected to the capacitor (for the built-in D/A converter L-CH)Not us

Seite 41

46MZ-NH900Pin No. Pin Name I/O Description193 USB_WAKE I System wake up signal input by USB connect194 A7CAL_SW I/O Current sense amplifier input, and

Seite 42

47MZ-NH900Pin No. Pin Name I/O Description237CC_CTL/VI_CTLO Constant current circuit control signal output terminal238XRST_MTR_DRVO Reset signal outpu

Seite 43

48MZ-NH900Pin No. Pin Name I/O Description287 SCS3 O Chip select signal output for LAM microcomputer communication Not used288 SCS4 O Chip select s

Seite 44

49MZ-NH900SECTION 7EXPLODED VIEWS7-1. CASE SECTIONRef. No. Part No. Description RemarkRef. No. Part No. Description Remark13-266-206-11 KNOB (OPEN)

Seite 45

5MZ-NH900SECTION 2GENERALThis section is extracted frominstruction manual.The recorderA •NAVI/ MENU buttonPress lightly to go to the NAVI (navigation

Seite 46

50MZ-NH9007-2. UPPER PANEL SECTIONRef. No. Part No. Description RemarkRef. No. Part No. Description Remark51 X-2023-708-1 PANEL (S) SUB ASSY, UPPER

Seite 47

51MZ-NH9007-3. CHASSIS SECTIONRef. No. Part No. Description RemarkRef. No. Part No. Description Remark101 3-266-499-01 OPEN SLIDER102 3-245-889-01 SP

Seite 48

52MZ-NH900The components identified bymark 0 or dotted line withmark 0 are critical for safety.Replace only with part num-ber specified.Les composants

Seite 49 - EXPLODED VIEWS

53MZ-NH900SECTION 8ELECTRICAL PARTS LISTRef. No. Part No. Description Remark Ref. No. Part No. Description RemarkX-2023-375-1 MAIN BOARD, COMPLETE

Seite 50

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark54MZ-NH900C429 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10VC434 1-125-777-11 CERAMI

Seite 51

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark55MZ-NH900C705 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16VC706 1-107-819-11 CERAM

Seite 52

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark56MZ-NH900D440 6-500-483-01 DIODE MA22D2800LS0D441 8-719-056-54 DIODE MAZS

Seite 53 - ELECTRICAL PARTS LIST

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark57MZ-NH900L805 1-216-295-00 SHORT CHIP 0L806 1-400-342-21 INDUCTOR 10uHL881 1-

Seite 54

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark58MZ-NH900R414 1-218-965-11 RES-CHIP 10K 5% 1/16WR415 1-218-961-11 RES-CHIP 4.

Seite 55

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark59MZ-NH900R670 1-218-990-11 SHORT CHIP 0R671 1-218-990-11 SHORT CHIP 0R673 1-2

Seite 56

6MZ-NH900The headphones/earphones with a remote controlA Vo l u me Control (VOL +, –)Turn to adjust the volume.B x (stop) buttonC Jog lever (NX/ENT, .

Seite 57

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark60MZ-NH900R935 1-208-935-11 METAL CHIP 100K 0.5% 1/16WR936 1-208-927-11 METAL

Seite 58

Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark61MZ-NH900511510Dedicated USB cable (1)Remote control (1)510AC power adaptor (

Seite 59

2MZ-NH900REVISION HISTORYClicking the version allows you to jump to the revised page.Also, clicking the version at the upper right on the revised pag

Seite 60

7MZ-NH900• This set can be disassembled in the order shown below.3-1. DISASSEMBLY FLOW3-2. CASE (LOWER) BLOCK(Page 8)3-3. MAIN BOARD(Page 8)3-4. UPPE

Seite 61

8MZ-NH9003-3. MAIN BOARDNote: Follow the disassembly procedure in the numerical order given.3-2. CASE (LOWER) BLOCK1Open the battery lid in the dire

Seite 62

9MZ-NH9003-4. UPPER PANEL BLOCK3-5. MECHANISM DECK(MT-MZNH900-181)BA4two screws(M1.4)3two screws(M1.4)5upper panel block1flexible board(CN471)2Slid

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